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5.0 mm dia led lamp rev: a / 1 pa ckage dimensions item materials resin epox y resin lead fr ame sn plating iron alloy draw ing no. : ds-35-07-0016 date : 2008-12-24 page : 1 hd-r/rd0 13 note: 1.all dimen sions ar e in millimeters. 2.tolerance is 0.25mm(0.010 ") unless otherwise specified. 3.protruded resin under flange is 1.5mm(0.059 ") max. 4.lead spacing is measured where the leads emerge from the package. 5.specification are subject to change without notice 6.highlight <-400v the led can withstand the max static level when assembling or operation(hbm). 7. the lamps have sharp and hard points that may injure human eyes or fingers etc., so please pay enough care in the handling. 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 feat ures * suitable hi gh pulse current operation * extra high radi ant intensity * high reliabil ity * low forw ard voltage * pb free products chip ma terials * dice material : ga inn/gan * light color : ul tra blue * lens color : wa ter clear absolute maximum ra ting : ( ta = 25 c ) symbol descript ion ultra blue unit p d power diss ipation per chip 120 mw v r reverse v oltage per chip 5 v i f a verage forward current per chip 30 ma i fp pulse forward current 100 ma - derating linear from 25c per chip 0.4 ma/c topr operating temperature range -25 c to 85 c tstg storage temperature range -25 c to 85 c electro-optical characteristics : ( ta = 25 c ) symbol descript ion test condition min. typ. max. unit v f forward v oltage i f = 20ma 3.5 4.0 v i r reverse current v r = 5v 100 a d dominant w avelength i f = 20ma 470 nm ? s pectral line half-width i f = 20ma 30 nm 2 1/2 half intensity angle i f = 20ma 15 deg i v luminous intensity i f = 20ma 3000 mcd fblk ic flicker frequency 1.30 1.60 1.90 hz vdd operating v oltage vdd=5vdc 2 5 15 v draw ing no. : ds-35-07-0016 date : 2008-12-24 page : 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 draw ing no. : ds-35-07-0016 date : 2008-12-24 page : 3 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 draw ing no. : ds-35-07-0016 date : 2008-12-24 page : 4 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 y soldering method soldering conditions remark dip soldering bath temperature: 260 immersion time: with 5 sec,1 time y solder no closer than 3mm from the base of the package y using soldering flux,? resin flux? is recommended. y attached data of temperatuare cure for your reference soldering iron soldering iron: 30w or smaller t emperature at tip of iron: 360 or lowe r soldering time: within 3 sec. y during soldering, t ake care not to press the tip of iron against the lead. (to prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) when soldering the lead of led in a condition that the p ack age is fixed with a panel (see fig.1), be careful not to stress the leads with iron tip. 2) when soldering wire to the l ead, work with a fig (see fig.2) to avoid stressing the package. regarding solution in the tinning oven for product- tinning, compound sub-solution made of tin & copper and sliver is proposed with the temper ature of celsius 260. the proportion of the alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. the time of tinning is constantly 3 seconds. draw ing no. : ds-35-07-0016 date : 2008-12-24 page : p a n e l (fig.1 ) l e a d w r i e s l e a v e a s l i g h t c l e a r a n c e l e a d w r i e s (fig.2 ) 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 3) similarly , when a jig is used to solder the led to pc board, take care as much as possible to avoid steering the leads (see fig.3). 4) repos itioning after soldering should be avoided as much as possible. if inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the led. 5) lead cutting after soldering should be performed only after the led temperature has returned to normal temperature. y storage 1) the leds should be s tored at 30 or less and 70% rh or less after being shipped from para and the storage life limits are 3 months . 2) para led lead frames are co mprised of a stannum plated iron al loy. the silver surface may be affected by environments which contain corrosive gases and so on. please avoid conditions which may cause the leds to corrode, tarnish or discolor. this corrosion or discoloration may cause difficulty during soldering operations. it is recommended that the leds be used as soon as possible. please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. y sta tic electricity 1) s tatic electricity or su rge voltage damages the leds. it is recommended that a wrist band or an anti-electrostatic glove be used when handling the leds. 2) all devices, equipment and machinery must be properly grounded. it is recommended that measures be taken against surge voltage to the equipment that mounts the leds. 3) when inspecting the final products in which leds were assemble d, it is recommended to check whether the assembled leds are damaged by stat ic electricity or not. it is easy to find static-damaged leds by a light-on test or a vf test at a lower current (below 1ma is recommended). 4) damaged leds will show some unusual characte ristics such as the leak current remarkably increases, the forward voltage becomes lower, or the leds do not light at the low current . criteria : ( vf>2.0v at if=0.5ma ) draw ing no. : ds-35-07-0016 date : 2008-12-24 page : 6 p c b o a r d ig. f ig 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 y led mounting method 4) when mounting the led by using a case, as shown fig.4, ensure that the mounting holds on the pc board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the led should be taken in to account especially when designing the case, pc board, etc. to prevent pitch misa lignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. alternatively, the shape of the holes should be made oval. (see fig.4) 5) use leds with stand-off (fig.5) or the tube or spacer made of re sin (fig.6) to position the leds. draw ing no. : ds-35-07-0016 date : 2008-12-24 page : 7 fig. 4 case pc board stan d-off fig.5 fig .6 tube 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 y formed lead 1) the lead s hould be bent at a point located at least 2mm away from the package. bending should be performed with base fixed means of a jig or pliers (fig.7) 2) forming lead should be carried our prior to so ldering and never during or after soldering. 3) form the lead to ensure alignment between the leads and the hole on bo ard, so that stress against the led is prevented. (fig.8) y lead strength 1) bend strength do not bend the lead more than twice. (fig.9) draw ing no. : ds-35-07-0016 date : 2008-12-24 page :8 2 m m f i g . 7 fi g .9 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 2) t ensile strength (@ room temperature) if the force is 1kg or less, t here will be no problem. (fig.10) y heat generation 1) thermal design of the end produc t is of para mount importance. please consider the heat generation of the led when making the system design. the coeffici ent of temperature increase per input electric power is affected by the th ermal resistance of the circuit board and density of led placement on the board, as well as other co mponents. it is necessary to avoid intense heat generation and operat e within the maximum ratings gi ven in this specification. the operating current should be decided after cons idering the ambient maximum temperature of leds. y chemical resist ance 1) a void exposure to chemicals as it may attack the led surface and cause discoloration. 2) when washing is required, refer to the follo wing table for the proper chemical to be sued. (immersion time: within 3 minut es at room temperature.) solvent adaptability freon te chlorothene w isopropyl alcohol thinner w acetone w tr ichloroethylene w --usable w--do not use. draw ing no. : ds-35-07-0016 date : 2008-12-24 page :9 ok fig. 10 1kg note: influences of ultrasonic cleaning of the led resin body differ depending on s uch factors as the oscillator output, size of the pc board and the way in which the led is mounted. therefore, ultrasonic cl eaning should only be performed after confirming t here is no problem by conducting a test under practical. 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 y others 1) care must be t aken to ensur e that the reverse voltage will not exceed the absolute maximum rating when using the leds with matrix drive. 2) flashing lights have been known to cause discomf ort in people; you can prevent this by taking precautions during use. also, people should be cautious when using equipment that has had leds incorporated into it. 3) the leds described in this brochure are in tended to be used for ordi nary electronic equipment (such as office equipment, communication s equipment, measurement instruments and household appliances). consult para?s sales staff in advance for information on the applications in which exceptional quality and reliability are r equired , particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reacto r control systems, automobiles, traffic control equipment, life support systems and safety devices). 4) user shall not reverse engineer by disassemblin g or analysis of the leds without having prior written consent from para. when defective leds are found, the user shall inform para directly before disassembling or analysis. 5) the formal specifications mu st be exchanged and signed by bot h parties before large volume purchase begins. 6) the appearance and specifications of the product may be modi fied for improvement without notice. draw ing no. : ds-35-07-0016 date : 2008-12-24 page :10 520LB7C-F2
5.0 mm dia led lamp rev: a / 1 bin code list forward vo ltage (vf), unit:v@20ma bin code min max v0 2.8 3.0 v1 3.0 3.2 v2 3.2 3.4 v3 3.4 3.6 v4 3.6 3.8 v5 3.8 4.0 to lerance of each bin are0.1volt to lerance of each bin are15% dominant wa velength( d ), unit:nm@20ma bin code min max d4 463 466 d5 466 469 d6 469 472 d7 472 474 d8 474 476 luminous intensity(iv), unit:mcd@20ma bin code min max i 1510 21 10 j 2110 2950 k 2950 4130 l 4130 5780 m 5780 8090 draw ing no. : ds-35-07-0016 date : 2008-12-24 page : 11 520LB7C-F2

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